/Tech2h ago

Huawei paper reveals Kirin 2026 processor benchmarks, claiming 41% lower power and 37.5% smaller die area

Story Overview

Huawei's new paper from executive He Tingbo introduces LogicFolding as a circuit-level trick that stacks logic tiers to cut signal delays, delivering the reported gains on the Kirin 2026 versus the Kirin 9030 Pro at iso-performance while tying into a broader Tau scaling framework meant to complement Moore's Law.

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Original post

Teortaxes▶️ (DeepSeek 推特🐋铁粉 2023 – ∞)@teortaxesTex#501inTech

Tau's Law V2. This confused me for a moment but it's at iso-performance. So with LogicFolding, Huawei can actually do a pretty cool thing, they raise the ceiling for free while opening a new tier of much colder high-end operation. The current 9030 Pro will be wholly obsolete.

Poe Zhao@poezhao0605

He Tingbo published a V2 of the Tao Law paper on ChinaXiv yesterday. The big addition: measured data.

Huawei now discloses voltage, frequency, power, and area benchmarks comparing Kirin 2026 against the Kirin9030 Pro baseline. Engineering details on LogicFolding and a more granular Ascend accelerator roadmap are also included.

Six weeks from theoretical framework to production data. The receipts are starting to come in.

2:16 AM · Jul 4, 2026 · 790 Views

Open Question

When the silicon actually ships

The design targets Huawei's own Mate and P-series phones with a fall 2026 rollout, but no third-party licensing details or confirmed production node are available yet.

Industry Shift

Longer-term scaling bets stay speculative

The paper floats density projections out to 2031, yet these remain forward-looking claims without silicon results beyond the current comparison.

Sentiment

Many users are excited about Huawei's Tau Law V2 and LogicFolding for Kirin 2026 chips because the promised power cuts and thermal improvements could deliver major efficiency gains and strong performance.

Pos

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Neg

0.0%

4 comments with sentiment.

Cluster Engagement

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VIEWS25.2K

Teortaxes▶️ (DeepSeek 推特🐋铁粉 2023 – ∞)@teortaxesTex

Tau Law V2. This confused me for a moment but it's at iso-performance. So with LogicFolding, Huawei can actually do a pretty cool thing, they raise the ceiling for free while opening a new tier of much colder high-end operation. The current 9030 Pro will be wholly obsolete.

Poe Zhao@poezhao0605

He Tingbo published a V2 of the Tao Law paper on ChinaXiv yesterday. The big addition: measured data.

Six weeks from theoretical framework to production data. The receipts are starting to come in.

2h25.2K3713

BOOKMARKS25LIKES73RETWEETS6REPLIES5

Zephyr@zephyr_z9

Looks like Logic Folding is damn good Waiting for the performance & die analysis of Kirin 9040 Very impressive

Teortaxes▶️ (DeepSeek 推特🐋铁粉 2023 – ∞)@teortaxesTex

2h14.9K7325

Zephyr@zephyr_z9

Looks like LogicFolding uses W2W Hybrid Bonding We previously thought that it would be D2D Hybrid Bonding

Teortaxes▶️ (DeepSeek 推特🐋铁粉 2023 – ∞)@teortaxesTex

2h12.9K2717

Teortaxes▶️ (DeepSeek 推特🐋铁粉 2023 – ∞)@teortaxesTex

they have a 3.4 Gz version in silicon. Would be amazing if it shaves another 30-40% at iso-performance due to dropping these limitations in 2026 gen. I think They need to move faster on AI chips though. Kirin is a breadwinner but not that strategically crucial. @zephyr_z9

Teortaxes▶️ (DeepSeek 推特🐋铁粉 2023 – ∞)@teortaxesTex

2h1.6K71

Zephyr@zephyr_z9

@teortaxesTex I'm waiting for the die analysis Would be the coolest thing in a looong while

Teortaxes▶️ (DeepSeek 推特🐋铁粉 2023 – ∞)@teortaxesTex

2h86650

Zephry@In_TheEvent_Of

@zephyr_z9 My strategy plan.

⬇️

1h30

Zephry@In_TheEvent_Of

@zephyr_z9 My strategy plan.

⬇️

1h24

零度@lngd196974

@zephyr_z9 不会有9040是9050

2h351

Sean@SomethingOnSnow

@zephyr_z9 Only 2 companies in the world that make their own CPU and own operating system. Never short these guys.

2h211

slayher@SlayherVag51673

@zephyr_z9 i knew this from emailing suss ir

2h37

Paco@Pacoxbt

@zephyr_z9 interesting correction

w2w bonding changes the packaging story quite a bit

1h30

Ai鱼头叔叔@Aiyutoushushu

@zephyr_z9 Impressive but yield & die cost will decide if it's real.🚀

1h27

US Watcher@pfw2001_h

@zephyr_z9 It was clear from the first paper. How would you think otherwise from reading the 25 June paper??

20m16

Semiconductor Insider@SemiconductorsX

@teortaxesTex Agree on the power wins potential, dropping thermal limits could make the 2026 Kirin a beast for phones, but yeah, Ascend needs the real urgency if want to close the AI gap.

2h15

truetrue@truetrue2355

@zephyr_z9 If the logic folding of the Kirin 9040 can truly leverage the Ceiling without cost, while opening up a low-heat high-end tier, then the existing 9030 Pro supply chain will face direct pressure to clear inventory.

2h10

Ai鱼头叔叔@Aiyutoushushu

@zephyr_z9 LogicFolding using W2W isn't a minor tweak—it's a fundamental shift in interconnect strategy, likely trading precision for density in an unexpected way. 🧠

1h9

Zephry@festicks

@In_TheEvent_Of @zephyr_z9 🚀Many of my Twitter followers have already joined my WhatsApp

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1h1

Zephry@festicks

@In_TheEvent_Of @zephyr_z9 🚀Many of my Twitter followers have already joined my WhatsApp

Click below to join my group ..

Here’s the link:http://wa.me/14023944817?text=777

➡️Reply "2026" to WhatsApp :+14023944817

I share my real-time TRADE alert (entry & exit points) on WhatsApp, free to join ✅

1h1